WireBond Inspection

Wire-Bond Inspection System

Overview

Advantages

Industry-First Automated Non-Contact (Non-Destructive) Wire-Bond Inspection Solution

- - Detects latent wire-bond issues undetectable by conventional ATE or X-ray, preventing test escapes.
  - Scalable to various package types, including non-standard and advanced packaging forms.
  - Designed to meet high-throughput production line requirements.
  - Ideal for complex structures, outperforming traditional AOI systems.
  - Enables early detection of arcing defects in automotive-grade chips, ensuring end-user safety.

Application

Single Package Test Mode

Designed for individual IC device testing in high-volume production environments.

Utilizes high-speed processors to enable mass production-level throughput.

Compact Mini ICT architecture (8 x Mini ICT) enables 8-site parallel testing within a single processor.

Standard Package Test Mode

Supports molded strip and leadframe IC devices in high-volume production environments.

Employs high-speed strip handlers for ultra-high-throughput testing.

Utilizes a compact KT7090 (16-channel) architecture to enable 16-site parallel testing within a single strip handler.